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Analog Devices and Linear Technology to merge

07/29/2016  Analog Devices, Inc. (NASDAQ: ADI) and Linear Technology Corporation (NASDAQ: LLTC) this week announced that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.

Scientists find a way of acquiring graphene-like films from salts to boost nanoelectronics

07/29/2016  Physicists use supercomputers to find a way of making 'imitation graphene' from salt.

STMicroelectronics acquires ams' NFC and RFID reader assets

07/29/2016  STMicroelectronics today announced that it has acquired ams' assets related to NFC1 and RFID2 reader business

Why are some MEMS devices successful while others are not?

07/28/2016  Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

Sustainable sensors to detect, predict muscle fatigue

07/28/2016  A new study published in the ECS Journal of Solid State Science and Technology aims to take advantage of sweat's trove of medical information through the development of a sustainable, wearable sensor to detect lactate levels in your perspiration.

Sensor sales keep hitting new records but price erosion curbs growth

07/22/2016  Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

07/21/2016  Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Research team led by NUS scientists develop plastic flexible magnetic memory device

07/20/2016  Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

STMicroelectronics unveils world's smallest single-chip motor driver

07/19/2016  With the combination of low power consumption and small form factor, the ST's new motor driver plans to contribute to the battery powered IoT device adoption.

Scientists glimpse inner workings of atomically thin transistors

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

Light-trapping 3D solar cells undergo space testing

07/18/2016  A novel three-dimensional solar cell design developed at Georgia Tech will soon get its first testing in space aboard the International Space Station.

SEMICON West Day 2: Don't Miss

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

Imec announces the opening of imec Florida

07/08/2016  Imec, a nanoelectronics research center, today announced the opening of imec Florida, a new entity focusing on photonics and high-speed electronics IC design based in Osceola, Florida.

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Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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