Applications

MAGAZINE



APPLICATIONS ARTICLES



HID Global predicts top trends for 2017 in the identity technology industry

01/11/2017  Shift in the use of trusted identities fuels broader adoption of mobile and advanced smart card technology, a greater emphasis on the Cloud and emerging IoT use cases.

STMicroelectronics incorporates CWS’ SiPEX in the RF PDK H9 SOI FEM

01/11/2017  Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

NIST physicists 'squeeze' light to cool microscopic drum below quantum limit

01/11/2017  Physicists at the National Institute of Standards and Technology (NIST) have cooled a mechanical object to a temperature lower than previously thought possible, below the so-called "quantum limit."

Researchers create practical and versatile microscopic optomechanical device

01/09/2017  Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

01/06/2017  Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

imec collaborates with City of Antwerp and Flanders to establish Smart City Living Lab

01/06/2017  How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable.

Vesper and DSP Group demo near-zero-power voice-activation for battery-powered devices at CES 2017

01/05/2017  Vesper, DSP Group and Sensory will demonstrate their new development platform from January 5-8, 2017 during CES 2017.

Intel to acquire 15% ownership of HERE

01/04/2017  Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE’s current indirect shareholders.

Bosch launches smallest high performance barometric pressure sensor at CES 2017

01/04/2017  Today, Bosch Sensortec launches the BMP380, the company's smallest and best performing barometric pressure sensor, with a compact size of only 2.0 x 2.0 x 0.75 mm3.

Gartner forecasts flat worldwide device shipments until 2018

01/04/2017  Emerging devices can enhance conventional device sales.

ESD Alliance reports EDA industry revenue increase for Q3 2016

12/23/2016  The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016.

Sensor sensation

12/22/2016  OIST researchers create a novel sensor capable of measuring both charge and mass of biomolecules with potential applications in healthcare diagnostics.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

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TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



High Efficiency Wireless: 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS