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06/15/2018The World Bank just updated its multiyear forecast for GDP growth both globally and by country....
Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018
06/06/2018Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019....
Semiconductor equipment record spending streak to continue through 2019
06/12/2018The semiconductor industry is nearing a third consecutive year of record equipment spending with projected growth of 14 percent (...
Led by Texas Instruments, the industrial semiconductor market grew nearly 12% in 2017
06/06/2018Analog Devices jumped to second in the market share ranking, after its acquisition of Linear Technology....

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Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
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Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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Could this material enable autonomous vehicles to come to market sooner?

06/19/2018  New material has optical properties that could enable better infrared detection for autonomous vehicles and assist firefighters.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

SEMI-FlexTech invites proposals for flexible hybrid electronics advances

06/19/2018  FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components.

Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

Global demand and supply for automotive display systems expected to maintain healthy growth in 2018

06/18/2018  The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business information provider IHS Markit.

FormFactor to collaborate with Keysight Technologies and GlobalFoundries

06/18/2018  FormFactor, Inc. (NASDAQ:FORM), an electrical test and measurement supplier to the semiconductor industry, announced today the company has deployed an integrated CM300xi probing solution for wafer-level testing of silicon photonics (SiPh) devices.

Scientists discover how to control the 'excitation' of electronics

06/18/2018  An international team of scientists, including NUST MISIS's Professor Gotthard Seifert, have made an important step towards the control of excitonic effects in two-dimensional van der Waals heterostructures.

Imec demonstrates manufacturability of spin-orbit torque MRAM devices on 300mm Si wafers

06/18/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nanoelectronics and digital technology, demonstrates for the first time the possibility to fabricate spin-orbit torque MRAM (SOT-MRAM) devices on 300mm wafers using CMOS compatible processes.

Qualcomm extends cash tender offer for all outstanding shares of NXP

06/15/2018  Qualcomm Incorporated has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors N.V.

Micross announces new executive appointment

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

FormFactor announces breakthrough improvements in productivity for RF probe systems

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

Synopsys IC Validator certified by Samsung Foundry for 7nm signoff physical verification

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys' IC Validator has been certified by Samsung Foundry for signoff of all designs using its 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Synopsys Fusion Technology enables lower power, high performance on Samsung Foundry 7LPP process with EUV

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Foundry has certified the Synopsys Design Platform with Fusion Technology for 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Wireless technologies to comprise 55% of connectivity IC shipments in 2018

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

Industrial internet and connected vehicles drive IoT sales through 2021​

06/14/2018  IC Market Drivers 2018 Update maintains solid revenue growth across all IoT end-use systems.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

Aledia selects Veeco Propel GaN MOCVD platform for large wafer 3D LED production

06/13/2018  Veeco Instruments Inc. has selected Veeco’s Propel GaN MOCVD system to support advanced research and development.

Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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EVENTS

Design Automation Conference 2018
San Francisco, CA
https://dac.com
June 24, 2018 - June 28, 2018


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NEW PRODUCTS

Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...
Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...