11/16/2018  SiFive, a provider of commercial RISC-V processor IP, today announced the appointment of Mohit Gupta as vice president of SoC IP.

11/16/2018  A team of researchers from Siberian Federal University (SFU) obtained thin copper/gold and iron/palladium films and studied the reactions that take place in them upon heating. Knowing these processes, scientists will be able to improve the properties of materials currently used in microelectronics.

11/15/2018  Artificial intelligence (AI) is on the verge of transforming entire industries as it gears up to power semiconductor industry innovation and growth, thrusting the technology to front and center at SEMICON Japan 2019, December 12-14 at the Tokyo Big Sight (Tokyo International Exhibition Center).

11/15/2018  Cabot Microelectronics Corporation (Nasdaq: CCMP), today announced that it has completed its previously announced acquisition of KMG Chemicals, Inc. 

11/15/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market.

11/15/2018  IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

11/14/2018  FormFactor, Inc., an electrical test and measurement supplier to the semiconductor industry, announced that it has been recognized for supplier excellence by SK hynix.

11/14/2018  A team from the University of Washington and the National Tsing Hua University in Taiwan announced that it has constructed functional metalenses that are one-tenth to one-half the thickness of the wavelengths of light that they focus. Their metalenses, which were constructed out of layered 2D materials, were as thin as 190 nanometers -- less than 1/100,000ths of an inch thick.

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

11/14/2018  Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles.

11/13/2018  Scientists at Nagoya Institute of Technology (NITech) and collaborating universities in Japan have gained new insights into the mechanisms behind degradation of a semiconductor material that is used in electronic devices.

11/13/2018  Exagan extends the range of its versatile G-FET and G-DRIVE products for the high-power market's multi-kilowatt applications.

11/13/2018  Micron Technology, Inc., (Nasdaq: MU) today announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology.

11/13/2018  World's smallest harvesting IC – ready for first use in upcoming hybrid smartwatches.

11/13/2018  Joining distinguished speakers from the European Commission, industry, academia and Member States, Laith Altimime, SEMI Europe president, will keynote on “European Competitiveness in the Context of the Global Digital Economy” on 20 November at the European Forum for Electronic Components and Systems (EFECS) in Lisbon, Portugal.

11/12/2018  EVG ComBond enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy.

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

11/12/2018  Micron Technology, Inc. today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement.

11/12/2018  Spin Memory, Inc. (Spin Memory), the MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution.