02/21/2019  Lithographically carved graphene and boron nitride 'sandwich' yields outstanding electrical properties.

02/21/2019  Researchers from EPFL's Laboratory of Semiconductor Materials, run by Anna Fontcuberta i Morral, together with colleagues from MIT and the IOFFE Institute, have come up with a way of growing nanowire networks in a highly controlled and fully reproducible manner.

02/21/2019  A team of Cambridge researchers have found a way to control the sea of nuclei in semiconductor quantum dots so they can operate as a quantum memory device.

02/21/2019  The 2019 FLEXI Awards has recognized outstanding accomplishments in the Flexible Hybrid Electronics (FHE) industry in 2018.

02/21/2019  UltraSoC today announced full support within its embedded analytics architecture for Western Digital's RISC-V SweRV Core and associated OmniXtend cache-coherent interconnect.

02/21/2019  POET Technologies Inc. and Photonic Integrated Circuits (PICs) for the data- and tele-communication markets, today announced that it had entered into an agreement with the highly-respected firm, MillView Photonics, Inc. to establish a collaborative design center in Ottawa, Ontario, Canada.

02/21/2019  Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

02/20/2019  pSemi Corporation today announced that its parent company and executive leadership has approved the recommendation of Chairman and Chief Executive Officer Jim Cable for an evolution of the company's senior leadership structure.

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

02/20/2019  Mobile market continues to favor RF SOI, with 8SW proving to be the industry's leading platform for power-optimized chips.

02/19/2019  Electro Scientific Industries (ESI), a division of MKS Instruments, Inc. and an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced an order for its recently-released CapStone laser drilling solution for processing flexible printed circuits (FPC).

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

02/19/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, and Shanghai Simgui Technology Co., Ltd., a Chinese silicon-based semiconductor materials company, jointly announced today an enhanced partnership and an increase in annual production capacity of 200mm silicon-on-insulator (SOI) wafers

02/19/2019  World electronic industry growth moderated (or contracted) in many sectors in late 2018.

02/15/2019  Addresses complex multicore systems for automotive, storage, at-scale computing.

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

02/15/2019  During IBM THINK 2019, IBM’s annual conference focused on technology and business, Samsung SDS announced it is continuing its collaboration with IBM in support of advancing Hyperledger Fabric, an open source cross-industry blockchain technology, with recent code contributions, research and a new white paper.

02/15/2019  Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.