12/18/2018  Contributing to improved user productivity and yield through operational monitoring and analysis for semiconductor manufacturing equipment.

12/18/2018  NYU researchers offer major new insights for precise engineering of ultra-small, ultra-sensitive electrochemical sensors.

12/18/2018  An international team of researchers has developed a technique that, for the first time, allows single-crystal hybrid perovskite materials to be integrated into electronics.

12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

12/17/2018  JEDEC Solid State Technology Association announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard.

12/17/2018  International research team, co-led by UC Riverside physicist, shows how pure graphene efficiently converts light into electricity.

12/17/2018  Using ultrasensitive magnetic probes, researchers unveil a surprising link between emergent magnetism and mechanical pressure in artificially engineered non-magnetic oxide heterostructures.

12/14/2018  RISC-V leader honored for its products, growth and performance by Global Semiconductor Alliance.

12/14/2018  MIT researchers have invented a way to fabricate nanoscale 3-D objects of nearly any shape. They can also pattern the objects with a variety of useful materials, including metals, quantum dots, and DNA.

12/14/2018  DRAM fastest growing market in four of past six years, demonstrating very cyclical market.

12/13/2018  Leading 200 mm foundry selects SST's SuperFlash technology for 110 nm CMOS process platform.

12/13/2018  Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.

12/13/2018  ClassOne Technology, global supplier of wet processing equipment for <200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany.

12/13/2018  Micron Technology, Inc., a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference design.

12/12/2018  Seoul Semiconductor Co., Ltd. announced that it won a patent litigation against Everlight Electronics Co., Ltd. in Germany.

12/12/2018  At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles.

12/11/2018  Lattice Semiconductor Corporation announced the appointment of Glenn O’Rourke as the Company’s Corporate Vice President, Global Operations, effective immediately.

12/11/2018  As the Silicon Valley in California and the West Coast continue to be the hub of the semiconductor manufacturing in the U.S., HEIDENHAIN has expanded its motion systems support by establishing an ETEL facility in Fremont, CA.

12/11/2018  Rudolph Technologies, Inc. today announced the receipt of over $12M in new orders for its recently-released NovusEdge system for edge and backside inspection on bare silicon wafers.