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06/15/2018The World Bank just updated its multiyear forecast for GDP growth both globally and by country....
 Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018
06/06/2018Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019....
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 Semiconductor equipment record spending streak to continue through 2019
06/12/2018The semiconductor industry is nearing a third consecutive year of record equipment spending with projected growth of 14 percent (...
 Led by Texas Instruments, the industrial semiconductor market grew nearly 12% in 2017
06/06/2018Analog Devices jumped to second in the market share ranking, after its acquisition of Linear Technology....
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Upcoming Webcasts Advanced PackagingDate and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and... LithographyDate and time TBDEUV lithography has been under intense development for years and appears to be close to... |
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RECOMMENDED TECHNOLOGY PAPERSMaximize uptime and optimize maintenance with AMSYukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018 Leveraging Baseline Checks for Robust Reliability VerificationAs IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018 Testing PAs under Digital Predistortion and Dynamic Power Supply ConditionsThe power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017 |
WEBCASTSAdvanced PackagingDate and time TBD Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.
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LithographyDate and time TBD EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.
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Environment, Safety & HealthDate and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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EVENTSMore Events |
NEW PRODUCTS Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...
 Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
 SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
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