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SEMI China, CASPA promote China-Silicon Valley innovation partnership
08/08/2018Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CA...
Mid-year global semiconductor sales up 20.4% compared to 2017
08/06/2018Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year....
DRAM sales forecast to top $100B this year with 39% market growth
08/09/2018With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent....
Process Watch: Automotive defect sensitivity requirements
08/07/2018Semiconductors continue to grow in importance in the automotive supply chain, requiring IC manufacturers to adapt their processes to produce ch...
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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NEWS ANALYSIS & FEATURES


Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

'Building up' stretchable electronics to be as multipurpose as your smartphone

08/13/2018  By stacking and connecting layers of stretchable circuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small in size.

Terahertz technology creates new insight into how semiconductor lasers work

08/13/2018  Pioneering engineers working with terahertz frequency technology have been researching how individual frequencies are selected when a laser is turned on, and how quickly the selection is made.

Optoelectronics market worth $9.80B by 2025

08/10/2018  The market is estimated to be USD 3.88 billion in 2018 and is projected to reach a market size of USD 9.80 billion by 2025, growing at a CAGR of 14.13% during the forecast period.

Seoul Viosys introduces new 'UV WICOP' in the UV LED market

08/10/2018  Seoul Viosys announced that its product named UV WICOP which combines Seoul Semiconductor’s WICOP LEDs with compact and high efficiency technology have been launched.

For UW physicists, the 2-D form of tungsten ditelluride is full of surprises

08/10/2018  The general public might think of the 21st century as an era of revolutionary technological platforms, such as smartphones or social media. But for many scientists, this century is the era of another type of platform: two-dimensional materials, and their unexpected secrets.

Yale-NUS scientist and collaborators solve open theoretical problem on electron interactions

08/10/2018  The discovery will help scientists better understand electron interaction in new materials, paving the way for developing advanced electronics such as faster processors.

CyberOptics demonstrates Airborne Particle and Ultra High-Resolution MRS sensors at SEMICON Taiwan

08/09/2018  Significantly improving yields and tool uptime in semiconductor fabs worldwide.

Rudolph Technologies appoints David B. Miller as Chairman of the Board

08/09/2018  Mr. Miller’s appointment is subsequent to the Company’s receipt of Thomas G. Greig’s resignation from the position.

ClassOne places Solstice CopperMax electroplating tool with defense industry supplier i3 Microsystems

08/09/2018  ClassOne, a supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced the sale its flagship Solstice S8 CopperMax electroplating tool to i3 of Binghamton, NY.

Multilayer chip beads with high rated currents

08/08/2018  TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

Tying down electrons with nanoribbons

08/08/2018  'Topological' graphene nanoribbons trap electrons for new quantum materials

Average design cost for basic SoCs across all geometries was $1.7M in 2017, says Semico Research

08/07/2018  The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

Integrated sensor could monitor brain aneurysm treatment

08/07/2018  A multi-university research team has demonstrated proof-of-concept for a highly flexible and stretchable sensor that could be integrated with the flow diverter to monitor hemodynamics in a blood vessel without costly diagnostic procedures.

Achronix and Mentor partner to provide link between high-level synthesis and FPGA technology

08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.

UMC and Avalanche Technology partner for MRAM development and 28nm production

08/06/2018  UMC will offer cost effective licensing of embedded 28nm non-volatile MRAM macros to its foundry customers.

Samsung Electronics starts mass production of industry's first 4-bit consumer SSD

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018


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NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...