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The "Wall," political gridlock and China: SEMI's take on SOTU address
02/12/2019For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. President’s pos...
Global semiconductor sales increase 13.7% to $468.8B in 2018
02/04/2019Global demand for semiconductors reached a new high in 2018, with annual sales hitting a high-water mark and total units shipped topping 1 t...
Taiwan maintains largest share of global IC wafer fab capacity
02/14/2019China shows biggest increase, nearly matching North America with 12.5% share in 2018....
China IC production forecast to show a strong 15% 2018-2023 CAGR
02/08/2019However, China’s indigenous IC production is still likely to fall far short of government targets....
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Environment, Safety & Health
Date and time TBDThe semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design,...
Wafer Processing
Date and time TBDAs the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch,...

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NEWS ANALYSIS & FEATURES


Source Photonics closes new funding for next-generation technologies

03/01/2019  Source Photonics, a global provider of optical transceivers, today announced it recently closed more than $100M in equity to support its growing data center and 5G business.

Dr. Jonathan Rich appointed as Lumileds CEO

03/01/2019  Lumileds today announced the appointment of Dr. Jonathan Rich as Chief Executive Officer. Dr. Rich most recently served as Chairman and CEO of Berry Global, Inc., a Fortune 500 specialty materials and consumer packaging company, from 2010 to 2018.

Hybrid material may outperform graphene in several applications

03/01/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

Organic electronics: Scientists develop a high-performance unipolar n-type thin-film transistor

03/01/2019  A research team at Tokyo Tech's Department of Materials Science and Engineering including Tsuyoshi Michinobu and Yang Wang report a way of increasing the electron mobility of semiconducting polymers, which have previously proven difficult to optimize.

Zips on the nanoscale

02/28/2019  New method of synthesising nanographene on metal oxide surfaces.

Hybrid material may outperform graphene in several applications

02/28/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

New SEMI Task Force focuses on quality management to meet new, higher reliability standards

02/28/2019  Technologies promising huge growth such as Artificial intelligence (AI), 5G, machine learning, high-performance computing, and telematics are ratcheting up pressure on semiconductor manufacturers in the race among product makers to accelerate time to market and capture share.

97 IC wafer fabs closed or repurposed during past 10 years

02/28/2019  90% of closures were ≤200mm wafer fabs; greatest number of closures in Japan.

ON Semiconductor names 2018 Distribution Partner Award winners

02/27/2019  ON Semiconductor today announced its top distribution partners for 2018.

Nova and GLOBALFOUNDRIES jointly awarded the 'Best Metrology Paper' at SPIE Advanced Lithography conference

02/27/2019  Demonstrating adaptive metrology capabilities using machine learning engines.

IBM elects Michelle J. Howard to its Board of Directors

02/27/2019  The IBM board of directors today elected Admiral Michelle J. Howard to the board, effective March 1, 2019.

Qualcomm, Samsung name new Si2 board members

02/27/2019  Qualcomm Incorporated and Samsung Electronics have named two executives to join the Silicon Integration Initiative board of directors. Si2 is a global research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Micron accelerates the mobile computing experience with introduction of new client SSD

02/27/2019  Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio.

French start-up moves to the edge with battery-operated devices

02/26/2019  The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy.

It's all in the twist: Physicists stack 2D materials at angles to trap particles

02/26/2019  Scientists create a unique platform to study quantum optical physics on the nanoscale.

Sigma Labs joins Manufacturing Technology Centre to advance industrialization of additive manufacturing with in-process quality control

02/26/2019  Sigma Labs, Inc. was named a member of the Manufacturing Technology Centre (MTC) located at Ansty Park, Coventry, UK.

Nominations open for ESD Alliance Governing Council

02/26/2019  The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

ASML joins the eBeam Initiative

02/26/2019  eBeam Initiative achieves new milestone with 50 member companies from the semiconductor photomask and lithography supply chain.

Cadence CMP Process Optimizer enables Toshiba Memory to accelerate delivery of advanced 3D Flash memory devices

02/25/2019  Cadence Design Systems, Inc. today announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices.

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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight’s Parametric Measurement Handbook (Rev 4)

Keysight Technologies’ popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.February 27, 2019
Sponsored by Keysight Technologies

A.I. Enabled Trace Analytics Simplifies Root Cause Analysis and Eliminates Events That Cause Yield Loss

Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019
Sponsored by BISTel

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

More Technology Papers

WEBCASTS

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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EVENTS

LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...