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Discovering the potential serial innovators in our midst
07/12/2018Steve Jobs. Benjamin Franklin. Albert Einstein. Marie Curie. What do these world-changers all have in common? Where did their drive to innovate ...
Next on-chip: Human organs
07/11/2018Many new innovations were discussed at imec’s U.S. International Technology Forum (ITF) on Monday at the Grand Hyatt in San Francisco, including quantum computing, artifici...
AI and quantum computing: The third and fourth exponentials
07/12/2018This is an era of computing which is at a scale that will dwarf the previous era, in ways that will change all of our businesses and all of o...
Solid State Technology and SEMI announce the 2018 Best of West Award winner
07/11/2018Solid State Technology and SEMI today announced the recipient of the 2017 "Best of West" Award – BISTel for its Dynamic Fa...
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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NEWS ANALYSIS & FEATURES


Silicon Labs expands senior management team

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

Intel to acquire eASIC

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

Boston Semi Equipment enhances MEMS sensor testing

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

Broadcom to acquire CA Technologies for $18.9B in cash

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

Bruker announces acquisition of JPK Instruments

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

South Korean and Chinese TV makers to increase panel purchases in third quarter despite concerns

07/13/2018  Despite concerns about TV demand and falling profit margins, major South Korean and Chinese TV makers are expected to stock up on display panels in the third quarter to prepare for the seasonal year-end shopping spree by consumers.

Electrical contact to molecules in semiconductor structures established for the first time

07/12/2018  Researchers from the University of Basel and IBM Research - Zurich have now developed a technique that allows electrical contact to individual molecules to be established.

Quantum dot white LEDs achieve record efficiency

07/12/2018  Novel approach to white LEDs could lead to more energy-efficient lighting.

New laser-based sample prep solution

07/12/2018  3D-Micromac AG (booth #1645 in the South Hall) this week introduced the microPREP 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).

Linde expands for sub 10nm geometries

07/12/2018  Gases and engineering company The Linde Group (Booth #5644 in the North hall) is investing in expansion of existing products to improve business continuity planning while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers

imec shows integrated 5G chip directions

07/12/2018  To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.

China's semi capex forecast to be larger than Europe and Japan combined in 2018

07/12/2018  The Mid-Year Update to the 2018 McClean Report revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.

New regulations coming for nitrous oxide

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

Day 3 of SEMICON West: Don't Miss

07/12/2018  Don't miss these big events today at SEMICON West!

HEIDENHAIN announces new CEO

07/11/2018  HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018.  At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.

Leti and Soitec launch a new substrate innovation center to develop engineered substrate solutions

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

Industry overshooting capital spending needs for NAND flash memory

07/11/2018  Overspending by the major NAND suppliers expected to further cool NAND flash prices this year.

MORE ANALYSIS & FEATURES

RESOURCE GUIDE - Get Listed


Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

More Technology Papers

WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...