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Strong 2Q'18 global supply chain growth but second half slowing
08/14/2018Semiconductor capital equipment sales are historically very volatile, with their growth fluctuating MUCH MORE than electronic equipment....
SEMI China, CASPA promote China-Silicon Valley innovation partnership
08/08/2018Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CA...
Size of semiconductor acquisitions may have hit limit
08/14/2018Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism a...
DRAM sales forecast to top $100B this year with 39% market growth
08/09/2018With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent....
Tech Papers
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Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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NEWS ANALYSIS & FEATURES


IBM and Synopsys accelerate 3nm process development with DTCO innovations

08/15/2018  Synopsys, Inc. today announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the pathfinding of new semiconductor process technologies for the 3-nanometer (nm) process node and beyond.

Automotive semiconductors to reach $73B by 2023, says Semico Research

08/15/2018  Automotive electronics are a bright light for the semiconductor industry, as smartphone growth slows, and personal computing growth continues to decline.

Cabot Microelectronics to acquire KMG Chemicals

08/15/2018  Cabot Microelectronics Corporation and KMG Chemicals, Inc. have entered into a definitive agreement under which Cabot Microelectronics will acquire KMG in a cash and stock transaction with a total enterprise value of approximately $1.6 billion.

pSemi announces world's first monolithic, SOI Wi-Fi front-end module

08/15/2018  pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduces the world’s first monolithic, silicon-on-insulator (SOI) Wi-Fi front-end module.

NSF awards $1.2M to Rochester Institute of Technology, University of California-San Diego, University of Delaware

08/14/2018  Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

TowerJazz to hold Technical Global Symposium (TGS) in China

08/14/2018  TowerJazz, the global specialty foundry, announced details of its China Technical Global Symposium (TGS) event in Shanghai on August 22, 2018.

Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

'Building up' stretchable electronics to be as multipurpose as your smartphone

08/13/2018  By stacking and connecting layers of stretchable circuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small in size.

Terahertz technology creates new insight into how semiconductor lasers work

08/13/2018  Pioneering engineers working with terahertz frequency technology have been researching how individual frequencies are selected when a laser is turned on, and how quickly the selection is made.

Optoelectronics market worth $9.80B by 2025

08/10/2018  The market is estimated to be USD 3.88 billion in 2018 and is projected to reach a market size of USD 9.80 billion by 2025, growing at a CAGR of 14.13% during the forecast period.

Seoul Viosys introduces new 'UV WICOP' in the UV LED market

08/10/2018  Seoul Viosys announced that its product named UV WICOP which combines Seoul Semiconductor’s WICOP LEDs with compact and high efficiency technology have been launched.

For UW physicists, the 2-D form of tungsten ditelluride is full of surprises

08/10/2018  The general public might think of the 21st century as an era of revolutionary technological platforms, such as smartphones or social media. But for many scientists, this century is the era of another type of platform: two-dimensional materials, and their unexpected secrets.

Yale-NUS scientist and collaborators solve open theoretical problem on electron interactions

08/10/2018  The discovery will help scientists better understand electron interaction in new materials, paving the way for developing advanced electronics such as faster processors.

CyberOptics demonstrates Airborne Particle and Ultra High-Resolution MRS sensors at SEMICON Taiwan

08/09/2018  Significantly improving yields and tool uptime in semiconductor fabs worldwide.

Rudolph Technologies appoints David B. Miller as Chairman of the Board

08/09/2018  Mr. Miller’s appointment is subsequent to the Company’s receipt of Thomas G. Greig’s resignation from the position.

ClassOne places Solstice CopperMax electroplating tool with defense industry supplier i3 Microsystems

08/09/2018  ClassOne, a supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced the sale its flagship Solstice S8 CopperMax electroplating tool to i3 of Binghamton, NY.

Multilayer chip beads with high rated currents

08/08/2018  TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

More Technology Papers

WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...