02/20/2019  pSemi Corporation today announced that its parent company and executive leadership has approved the recommendation of Chairman and Chief Executive Officer Jim Cable for an evolution of the company's senior leadership structure.

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

02/20/2019  Mobile market continues to favor RF SOI, with 8SW proving to be the industry's leading platform for power-optimized chips.

02/19/2019  Electro Scientific Industries (ESI), a division of MKS Instruments, Inc. and an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced an order for its recently-released CapStone laser drilling solution for processing flexible printed circuits (FPC).

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

02/19/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, and Shanghai Simgui Technology Co., Ltd., a Chinese silicon-based semiconductor materials company, jointly announced today an enhanced partnership and an increase in annual production capacity of 200mm silicon-on-insulator (SOI) wafers

02/19/2019  World electronic industry growth moderated (or contracted) in many sectors in late 2018.

02/15/2019  Addresses complex multicore systems for automotive, storage, at-scale computing.

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

02/15/2019  During IBM THINK 2019, IBM’s annual conference focused on technology and business, Samsung SDS announced it is continuing its collaboration with IBM in support of advancing Hyperledger Fabric, an open source cross-industry blockchain technology, with recent code contributions, research and a new white paper.

02/15/2019  Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.

02/15/2019  Chemical data mining boosts search for new organic semiconductors.

02/15/2019  Switching superferromagnetism with electric-field induced strain.

02/14/2019  Organic semiconductors are lightweight, flexible and easy to manufacture. But they often fail to meet expectations regarding efficiency and stability. Researchers at the Technical University of Munich (TUM) are now deploying data mining approaches to identify promising organic compounds for the electronics of the future.

02/14/2019  Scientists at the U.S. Naval Research Laboratory (NRL) and the Air Force Research Laboratory (AFRL) have developed a way to directly write quantum light sources, which emit a single photon of light at a time, into monolayer semiconductors such as tungsten diselenide.

02/14/2019  The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion.

02/14/2019  Silicon Catalyst, the world's only incubator focused exclusively on accelerating solutions in silicon, today announced Soitec, a designer and manufacturer of semiconductor materials, as its first European Strategic Partner.

02/13/2019  As group vice president of the Analog & MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers.