10/03/2018  ANSYS announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology.

10/03/2018  Transition metal dichalcogenides (TMDCs) possess optical properties that could be used to make computers run a million times faster and store information a million times more energy-efficiently, according to a study led by Georgia State University.

10/03/2018  SMART Global Holdings, Inc., parent company of SMART Modular Technologies, Inc. announced the appointment of Bryan Ingram, Senior Vice President and General Manager of the Wireless Semiconductor Division of Broadcom Inc., to its board of directors and its Compensation Committee, effective October 2, 2018.

10/02/2018  HEIDENHAIN announces a new series of angle encoders called the ERP 1000 with the design criteria of exceptionally high resolution, high speed, and high contamination resistance.

10/02/2018  Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013.

10/02/2018  Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs on $200 billion in goods imported from China.

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.

10/01/2018  Synopsys, Inc. today announced delivery of automotive-grade DesignWare Controller and PHY IP for TSMC's 7-nanometer (nm) FinFET process.

10/01/2018  Visionary keynote speakers and industry luminaries will share insights on Smart technologies that are shaping the future at SEMICON Japan 2018, the largest and most influential exhibition in Japan for electronics manufacturing.

10/01/2018  Recognizing the importance of obsolescence mitigation in embedded and industrial systems, two of the biggest names in advanced storage, memory and semiconductor technologies have teamed up to ensure the continuous supply of legacy DDR2 memory modules in the market.

10/01/2018  Researchers are documenting the different temperature and proton dosages required to make defects that will further allow silicon carbide to be used for quantum technology.

09/28/2018  Investment to enhance connected mobility solutions for automotive manufacturers building intelligent next-generation vehicles.

09/28/2018  Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES' 22FDX process.

09/28/2018  The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.

09/28/2018  Nanostructures can increase the sensitivity of optical sensors enormously - provided that the geometry meets certain conditions and matches the wavelength of the incident light. This is because the electromagnetic field of light can be greatly amplified or reduced by the local nanostructure. The HZB Young Investigator Group "Nano-SIPPE" headed by Prof. Christiane Becker is working to develop these kinds of nanostructures.

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

09/27/2018  Mini diaphragm gauges offer a new alternative to Bourdon tubes.

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.