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Seven IC products to outpace total 16% IC market growth in 2018
09/18/201813 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales....
New fabs invest over $220B; 2019 to mark all-time spending high
09/17/2018Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billi...
SEMI FabView update: More investments in semiconductor fabs
09/21/2018Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based...
New Thinking Required for Machine Learning
09/17/2018Speakers argue the semiconductor community thus far has not been doing enough to enable machine intelligence....
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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NEWS ANALYSIS & FEATURES


Lam Research names 2018 Supplier Excellence Award recipients

09/21/2018  Six companies awarded for overall supplier excellence.

RISC-V Foundation announces initial keynote speakers for inaugural RISC-V Summit

09/21/2018  First RISC-V Summit features keynotes from Antmicro, Facebook, Microchip Technology, NXP, SiFive and Western Digital.

Micron appoints Mike Bokan as Senior VP, Worldwide Sales

09/21/2018  Micron Technology, Inc. announced today that the company has appointed Mike Bokan as senior vice president of Worldwide Sales, effective Oct. 1, 2018.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

Toshiba Memory and Western Digital celebrate the opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan

09/20/2018  Toshiba Memory Corporation and Western Digital Corporation yesterday celebrated the opening of a new semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan.

Graphene bilayer provides efficient transport and control of spins

09/20/2018  University of Groningen physicists in collaboration with a theoretical physics group from Universität Regensburg have built an optimized bilayer graphene device which displays both long spin lifetimes and electrically controllable spin-lifetime anisotropy.

NXP Semiconductors announces $1B bridge financing

09/20/2018  NXP announced a US$1,000,000,000 senior unsecured bridge term credit facility agreement.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

Leti announces EU project to develop powerful, inexpensive sensors with photonic integrated circuits

09/19/2018  Leti, a research institute of CEA Tech, today announced the launch of the REDFINCH consortium to develop the next generation of miniaturized, portable optical sensors for chemical detection in both gases and liquids.

Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.

How will graphene, the 2D wonder material, change the semiconductor industry?

09/19/2018  What materials innovation will the future bring?

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

09/18/2018  Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Open-Silicon appoints new VP of Engineering

09/18/2018  Anand Bariya brings 25 years of engineering management experience to custom silicon solution provider.

TowerJazz annual U.S. Technical Symposium to showcase its advanced analog specialty process offerings

09/18/2018  During TGS, the company will share its vision on industry megatrends: "Wireless Everything, Smart Everything, Green Everything" - and the means by which its analog specialty portfolio helps customers to differentiate their technology solutions.

Keysight Technologies' 3D planar electromagnetic simulator certified for GLOBALFOUNDRIES 22FDX process technology

09/18/2018  Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, today announced that the company's 3D planar electromagnetic (EM) simulator, Momentum, has been certified for GLOBALFOUNDRIES (GF) 22FDX, 22nm Fully-Depleted Silicon-On-Insulator (FD-SOI) technology.

Energy Taiwan: Inaugural international event aims to speed clean energy technology innovation

09/18/2018  With Taiwan poised as a central player role in global renewable energy, the stage is set for the inaugural Energy Taiwan, Taiwan's largest green energy technology exchange platform that aims to accelerate innovation of clean energy technologies.

eBeam Initiative surveys report 27% growth in photomasks delivered, continued confidence in EUV

09/17/2018  Results of annual Perceptions and Mask Makers' Surveys to be presented at SPIE Photomask Technology Conference; TEL joins eBeam Initiative.

When 80 microns is enough

09/17/2018  Moving spins across ever larger (but still small) distances makes for a big advance in spintronics.

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RESOURCE GUIDE - Get Listed


Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...