07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

07/13/2018  Despite concerns about TV demand and falling profit margins, major South Korean and Chinese TV makers are expected to stock up on display panels in the third quarter to prepare for the seasonal year-end shopping spree by consumers.

07/12/2018  Researchers from the University of Basel and IBM Research - Zurich have now developed a technique that allows electrical contact to individual molecules to be established.

07/12/2018  Novel approach to white LEDs could lead to more energy-efficient lighting.

07/12/2018  3D-Micromac AG (booth #1645 in the South Hall) this week introduced the microPREP 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).

07/12/2018  Gases and engineering company The Linde Group (Booth #5644 in the North hall) is investing in expansion of existing products to improve business continuity planning while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers

07/12/2018  To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.

07/12/2018  The Mid-Year Update to the 2018 McClean Report revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

07/12/2018  Don't miss these big events today at SEMICON West!

07/11/2018  HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018.  At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

07/11/2018  Overspending by the major NAND suppliers expected to further cool NAND flash prices this year.