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Global, U.S. electronics supply chains see healthy midyear business conditions
05/18/2018The first quarter of this year was very strong globally, with growth across the entire electronics supply chain. ...
LG Display retains its lead in area shipments of large displays in first quarter of 2018
05/15/2018Large display panel shipments show better-than-expected results compared to previous first quarters....
Thirteen Top-15 1Q18 semi suppliers register double-digit gains
05/16/2018Samsung extends its number one ranking and sales lead over Intel to 23%....
Integration with global ecosystem key to growth of China's semiconductor industry
05/10/2018The growth of China’s semiconductor industry outstripped sector expansion in many other regions in 2017 thanks in par...

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May 20 – 23, 2018


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NEWS ANALYSIS & FEATURES


Global semiconductor glass wafer market to witness growth through 2022 owing to the proliferation of IoT

05/18/2018  Technavio projects the global semiconductor glass wafer market to post a CAGR of more than 6% during the forecast period. The emergence of advanced and compact consumer electronic devices is a key driver, which is expected to impact market growth.

Keep the light off: A material with improved mechanical performance in the dark

05/18/2018  Researchers at Nagoya University find an inorganic semiconductor is brittle when exposed to light, but flexible in the dark.

SEMI opposes trade tariffs against China, cites damaging impact to chip industry in U.S. government testimony

05/18/2018  Testifying before a U.S. interagency panel weighing trade tariffs against China, a representative from the semiconductor manufacturing industry yesterday called for the removal of more than 100 products from the list of proposed tariffs, stressing that an escalation of the U.S.-Sino dispute could trigger a full-blown trade war and hasten deep, unintended damage including higher consumer prices, an expanded U.S. trade deficit, and a slowdown in U.S. economic growth.

Plasma-Therm earns multiple 'RANKED 1st' awards in industry survey

05/17/2018  For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX

05/17/2018  More than 400 laser systems from 3D-Micromac installed worldwide; dozens of excimer laser systems used for display and microelectronics manufacturing.

Molex announces acquisition of BittWare

05/17/2018  New Hampshire company specializes in high-end FPGA computing platforms designed to improve performance and time-to-revenue for OEMs.

Advanced materials: processing glass like a polymer

05/17/2018  KIT materials scientists develop new forming technology -- publication in advanced materials.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

05/17/2018  In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Crossbar announces licensing relationship agreement with Microsemi

05/16/2018  Companies announce strategic collaboration to integrate ReRAM technology in Microsemi products.

New device could increase battery life of electronics by a hundred-fold

05/16/2018  Researchers developed the device and are working on commercializing it.

Researchers control the properties of graphene transistors using pressure

05/16/2018  A Columbia University-led international team of researchers has developed a technique to manipulate the electrical conductivity of graphene with compression, bringing the material one step closer to being a viable semiconductor for use in today's electronic devices.

Synopsys IC Validator certified by GLOBALFOUNDRIES for signoff physical verification

05/15/2018  Synopsys, Inc. today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys IC Validator tool for physical signoff on the GF 14LPP process technology.

Sciaky receives order for multiple Electron Beam Additive Manufacturing systems

05/15/2018  Sciaky, Inc. announced today that it has received an order for multiple Electron Beam Additive Manufacturing systems to bolster the nation's defense and power generation programs.

Analysis of causality principle for the conductivity of graphene

05/15/2018  A paper by Kazan University and Russian Academy of Sciences appeared in Physical Review D.

EV Group secures lithography order from VTT Technical Research Centre

05/15/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG120 automated resist processing system from VTT Technical Research Centre of Finland (VTT).

Presto Engineering joins GLOBALFOUNDRIES Ecosystem as ASIC Partner

05/15/2018  Presto Engineering Inc. today announced that it has joined GLOBALSOLUTIONS, GF's ecosystem of partners that provides services from conception to production.

Engineers on a roll toward smaller, more efficient radio frequency transformers

05/14/2018  The future of electronic devices lies partly within the "internet of things" - the network of devices, vehicles and appliances embedded within electronics to enable connectivity and data exchange. University of Illinois engineers are helping realize this future by minimizing the size of one notoriously large element of integrated circuits used for wireless communication - the transformer.

Scientists discover how a pinch of salt can improve battery performance

05/14/2018  Researchers at Queen Mary University of London, University of Cambridge and Max Planck Institute for Solid State Research have discovered how a pinch of salt can be used to drastically improve the performance of batteries.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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WEBCASTS

Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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More Webcasts

EVENTS

Design Automation Conference 2018
San Francisco, CA
https://dac.com
June 24, 2018 - June 28, 2018
SEMICON West 2018
San Francisco, CA
http://www.semiconwest.org
July 10, 2018 - July 12, 2018
Strategic Materials Conference
San Jose, CA
http://www.semi.org/en/node/129331
September 24, 2018 - September 26, 2018


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