07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

07/20/2018  Optical training of neural networks could lead to more efficient artificial intelligence.

07/20/2018  The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.

07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

07/19/2018  Large thin-film transistor liquid crystal display (TFT LCD) panel makers are expected to reduce production of comparatively smaller sized 32-, 40- and 43-inch panels, helping to stabilize panel prices in the third quarter of 2018.

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

07/19/2018  New material draws heat away from hotspots much faster than current materials.

07/18/2018  The board has named Rich Templeton, the company's chairman, to reassume the roles of president and CEO on an ongoing, indefinite basis, in addition to continuing as chairman.

07/18/2018  Amkor Technology, Inc., a provider of outsourced semiconductor packaging and test (OSAT) services, today announced it has partnered with Mentor to release Amkor’s SmartPackage Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools.

07/18/2018  The international team of scientist found a way to improve nanocomposite material to use it in hydrogen economy.

07/17/2018  With every smartphone brand applying the 18:9 and wider aspect ratio screens to its newer models, the rate of adoption is expected to quicken in the second half of 2018.

07/17/2018  Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

07/17/2018  Scientists at NUS have discovered a new way to closely look at the electronic quantum behaviour of materials, giving a deeper understanding of how they could be used for future quantum computing applications.

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.