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Semi content in electronic systems forecast to reach 31.4% in 2018
07/19/2018Semi content to surpass 30% this year, smashing the previous record high set just last year....
Micron and Intel announce update to 3D XPoint joint development program
07/17/2018Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the developme...
Emerging Memory Types Headed for Volumes
07/18/2018After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel and Micron, and the embedded spin-torque...
AI and quantum computing: The third and fourth exponentials
07/12/2018This is an era of computing which is at a scale that will dwarf the previous era, in ways that will change all of our businesses and all of o...
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and...
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to...

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NEWS ANALYSIS & FEATURES


Future electronic components to be printed like newspapers

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

Researchers move closer to completely optical artificial neural network

07/20/2018  Optical training of neural networks could lead to more efficient artificial intelligence.

IBM, Nissan and Toshiba talk computing and smart car innovations: Key takeaways from SEMI Japan Members Day

07/20/2018  The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.

SEMI China Equipment & Materials Committee meeting targets region's semiconductor industry growth

07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

Rahul Goyal of Intel elected Board Chair of Silicon Integration Initiative

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Long-term oversupply of large TFT LCD panels will prompt restructuring of older fabs

07/19/2018  Large thin-film transistor liquid crystal display (TFT LCD) panel makers are expected to reduce production of comparatively smaller sized 32-, 40- and 43-inch panels, helping to stabilize panel prices in the third quarter of 2018.

Puzzling results explained: A multiband approach to Coulomb drag and indirect excitons

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

UCLA engineers develop world's most efficient semiconductor for thermal management

07/19/2018  New material draws heat away from hotspots much faster than current materials.

Texas Instruments CEO resigns

07/18/2018  The board has named Rich Templeton, the company's chairman, to reassume the roles of president and CEO on an ongoing, indefinite basis, in addition to continuing as chairman.

Amkor delivers package assembly design kit to support Mentor’s high-density advanced packaging tools

07/18/2018  Amkor Technology, Inc., a provider of outsourced semiconductor packaging and test (OSAT) services, today announced it has partnered with Mentor to release Amkor’s SmartPackage Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools.

Gold nanoparticles to find applications in hydrogen economy

07/18/2018  The international team of scientist found a way to improve nanocomposite material to use it in hydrogen economy.

Smartphone displays set to move rapidly to 18:9 and wider aspect ratios in second half of 2018

07/17/2018  With every smartphone brand applying the 18:9 and wider aspect ratio screens to its newer models, the rate of adoption is expected to quicken in the second half of 2018.

Electronic stickers to streamline large-scale 'internet of things'

07/17/2018  Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

A step closer to quantum computers: NUS researchers show how to directly observe quantum spin effects

07/17/2018  Scientists at NUS have discovered a new way to closely look at the electronic quantum behaviour of materials, giving a deeper understanding of how they could be used for future quantum computing applications.

Silicon Labs expands senior management team

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

Intel to acquire eASIC

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

Boston Semi Equipment enhances MEMS sensor testing

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

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Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
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WEBCASTS

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018


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NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...