Applications

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APPLICATIONS ARTICLES



'Building up' stretchable electronics to be as multipurpose as your smartphone

08/13/2018  By stacking and connecting layers of stretchable circuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small in size.

Integrated sensor could monitor brain aneurysm treatment

08/07/2018  A multi-university research team has demonstrated proof-of-concept for a highly flexible and stretchable sensor that could be integrated with the flow diverter to monitor hemodynamics in a blood vessel without costly diagnostic procedures.

SEMI High-Tech Facility events: Shaping the future of smart factories in Taiwan

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

Wearable devices: Useful medical insights or just more data?

08/02/2018  A new review looks at the booming industry of measuring 'every breath you take and every move you make'.

Memory-processing unit could bring memristors to the masses

07/30/2018  A new way of arranging advanced computer components called memristors on a chip could enable them to be used for general computing, which could cut energy consumption by a factor of 100.

Imec scientist awarded ERC starting grant to develop ultra-small microscopes

07/30/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, announces that Niels Verellen, one of its young scientists, has been awarded an ERC Starting Grant.

NIST chip lights up optical neural network demo

07/27/2018  Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature brain-like grid, showcasing a potential new design for neural networks.

School district of Osceola County first to deliver SEMI High Tech U program

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

Generation of random numbers by measuring phase fluctuations from a laser diode with a silicon-on-in

07/24/2018  Millimeter-scale chip uses less power to create quantum random numbers at high speeds.

Applied Materials team selected by DARPA to develop advanced technology for artificial intelligence

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

Park Systems announces Park Nanoscience Lab at Indian Institute of Science in India

07/23/2018  Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

Writing the future of rewritable memory

07/23/2018  Scientists have perfected a technique to exceed capacity of current hard drives 1000-fold.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS